Resin molding process
What we pursue is "high precision" and "processing that does not stress the material."
At Mikata Co., Ltd., we propose a resin cutting process that allows for stress-free extraction of resin films. When processing adhesive materials and wrapping them, there can be adhesive overflow from the side of the adhesive material (cut surface) as it approaches the paper tube (core) section. However, we have successfully implemented a wrapping technique that prevents overflow. 【Features】 ■ Almost no adhesive overflow occurs during the cutting process with our stress-free method. ■ Achieves a cross-section with almost no burrs. *For more details, please contact us or download the catalog.
- Company：美方
- Price：Other
